He is an IEEE Fellow and Associate Professor of Materials Science and Engineering at the National University of Singapore. He leads the research team, paying special attention to hiring, designing the work plans, reviewing the data of the students, helping them prepare the plots, and writing big portions of the manuscripts. He is also in charge of applying for funding to maintain all the members.

He is a research scientist specialized in very large scale integration (VLSI) circuit design, device and circuit reliability characterization, as well as multi-scale device/circuit simulation. He uses the semi-automatic probe station and specialized characterization boards to measure thousands of novel-materials-based electronic devices, including yield, variability, reliability and stability tests.

She is a postdoctoral fellow in our group since August 2025. She got her PhD in Materials Science and Engineering at the King Abdullah University of Science and Technology (KAUST). She is expert in nanoelectronic characterization of materials using conductive atomic force microscopy. She also fabricates and characterizes hybrid 2D/CMOS microchips, and developed the first on-chip atomristors.

She is a postdoctoral fellow in our group since August 2025. She got her PhD in Physical Electronics from Peking University (China) in June 2025. During her PhD she was visiting scholar at ETH Zurich for one year. She is expert in novel nanomaterials integration on silicon microchips for memory and computation.

She is a postdoctoral fellow in our group since August 2025. She got her PhD in Materials Science and Engineering at the King Abdullah University of Science and Technology (KAUST). She is expert in 2D materials based device fabrication and testing. She is also expert in building excellent metal/2D materials interfaces and analyze densities of atomic defects using transmission electron microscopy.

She is a postdoctoral fellow and lab manager in our group since March 2025. Before that, she got a PhD in Materials Science and Engineering from Soochow University in 2018, where she also worked as postdoctoral fellow. She is expert in electronic materials characterization using scanning probe microscopy and transmission electron microscopy.

He is a postdoctoral fellow in our group since December 2025. He got his PhD in Mechanical Engineering from Shanghai Jiao Tong University, in June 2025. He is expert in advanced nanopositioning for high-throughput atomic force microscopy. He received the prestigious Shanghai Jiao Tong University Overseas Joint Postdoctoral Fellowship Program.

She is a PhD student in our group since August 2025, working on the array level characterization of hybrid 2D/CMOS microchips for memristive applications and NSRAM based neural networks. Before joining us, she completed a Master in Integrated Circuits at Tsinghua University, in Beijing (China).

He is a PhD student in our group since January 2026. He go the Bachelor in Electronics and Automation Engineering in 2016, and the Master in Engineering with a focus on Mechatronics in 2018, both at Universidad Autonoma de Nuevo Leon (Mexico). After that, he worked as Lecturer in the same university, and he was promoted to Coordinator of Laboratories.

He is a PhD student in Materials Science and Engineering at the King Abdullah University of Science and Technology (KAUST). He is expert on the fabrication of selectors, made of two-dimensional materials, on silicon microchips. He has also mastered the use of conductive atomic force microscopy for the characterization of small nanodot-like electronic devices.

She is a PhD student in Materials Science and Engineering at the King Abdullah University of Science and Technology (KAUST). She is expert on the CVD synthesis of novel nanomaterials. She has also extensive experience on the nanoscale and atomic-scale characterization of pinholes and other defects in two-dimensional materials grown on 2-inch and 4-inch wafers.